SOLAR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package for solar power generation is provided to reduce manufacturing costs by fitting a second assembly structure into a first assembly structure with a simple assembly structure. CONSTITUTION: A semiconductor chip for solar power generation is attached to a substrate(12). A sunlight collecting unit(16) is injection-molded on the upper center of a conductive housing. The sunlight collecting unit is separated from the upper side of the semiconductor chip with a preset distance. A first electrode step(18) and a second electrode step(20) with different heights are formed on the lower edges of the conductive housing. A conductive adhesion unit conductively adheres a conductive pattern to the second electrode step. The conductive adhesion unit adheres a bonding pad to the first electrode step.