| 摘要 |
PURPOSE: A stack USB memory device ad a manufacturing method thereof are provided to reduce the size of the stack USB memory device by mounting a passive device, a control semiconductor chip, and a functional semiconductor chip in a recess region of a substrate. CONSTITUTION: A substrate(100) includes one or more recess regions(102). A passive device(110) is mounted on one or more recess regions. A control semiconductor chip(120) is mounted on one or more recess regions. A functional semiconductor chip(130) is mounted on one or more recess regions. An external wiring pattern(108) is formed on a second surface of the substrate. |
