发明名称 |
Conductive ball mounting apparatus and conductive ball mounting method |
摘要 |
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
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申请公布号 |
US7900807(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20100720084 |
申请日期 |
2010.03.09 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
IIDA KIYOAKI;TANAKA KAZUO;KONDO NORIO;SAKAGUCHI HIDEAKI;HIGASHI MITSUTOSHI |
分类号 |
B23K1/00;B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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