发明名称 |
Multilayer anisotropic conductive adhesive and connection structure using the same |
摘要 |
A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.
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申请公布号 |
US7901768(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20040571495 |
申请日期 |
2004.09.09 |
申请人 |
SONY CORPORATION;SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
KUMAKURA HIROYUKI |
分类号 |
B32B7/12;B32B27/38;B32B27/42;C09J7/00;C09J9/02;H01R4/04;H05K3/32 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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