APPARATUS AND METHOD OF TREATING SUBSTRATE

摘要

PURPOSE: A substrate processing apparatus and a method thereof are provided to reduce the footprint by polishing and cleansing a plurality of wafers simultaneously. CONSTITUTION: A loading/unloading unit comprises a plurality of load ports(11a). At least one substrate polishing part(1001) polishes the substrate. The substrate cleaning part for washing the substrate is installed on the top of the substrate polishing part. A buffer part accepts the substrate completed by the substrate polishing unit or the substrate cleansing unit.