发明名称 |
Integrated circuit package system for electromagnetic isolation |
摘要 |
An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
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申请公布号 |
US7902644(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20070952951 |
申请日期 |
2007.12.07 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
HUANG RUI;DO BYUNG TAI;CHOW SENG GUAN;KUAN HEAP HOE |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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