发明名称 |
Semiconductor package and semiconductor system in package using the same |
摘要 |
Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.
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申请公布号 |
US7902652(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20070894338 |
申请日期 |
2007.08.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SEO HO-SEONG;CHO SHI-YUN;LEE YOUNG-MIN;KIM SANG-HYUN |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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