发明名称 |
Method of manufacturing sealed electronic component and sealed electronic component |
摘要 |
A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.
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申请公布号 |
US7902481(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20050547323 |
申请日期 |
2005.03.30 |
申请人 |
CITIZEN HOLDINGS CO., LTD;CITIZEN FINETECH MIYOTA CO., LTD |
发明人 |
KIGAWA KEISUKE;HIRATSUKA HARUYUKI;WADA TOMOHISA |
分类号 |
H01L21/50;H01L23/02;B23K26/20;H03H3/02;H03H9/02;H03H9/10 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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