发明名称 Method of manufacturing sealed electronic component and sealed electronic component
摘要 A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.
申请公布号 US7902481(B2) 申请公布日期 2011.03.08
申请号 US20050547323 申请日期 2005.03.30
申请人 CITIZEN HOLDINGS CO., LTD;CITIZEN FINETECH MIYOTA CO., LTD 发明人 KIGAWA KEISUKE;HIRATSUKA HARUYUKI;WADA TOMOHISA
分类号 H01L21/50;H01L23/02;B23K26/20;H03H3/02;H03H9/02;H03H9/10 主分类号 H01L21/50
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