PURPOSE: A printed circuit board manufacturing method is provided to remarkably reduce the manufacturing cost by preventing the forming of the plating layer more than required on the unnecessary area. CONSTITUTION: Plating lead lines(236, 238) are formed in order to implement the plating in the unit zone. A plurality of strips is formed on the strip area. A dummy area is prepared on the outside of the strip area. A mold gate(212) is arranged on the outside of the unit zone. A metal layer and a plating lead line formed on the surface of the mold gate are connected to a lead line(214).
