发明名称 Secure physical connections formed by a kinetic spray process
摘要 A process for physically bonding two parts to each other is disclosed. In addition, a process for forming electrical connections have a low resistance is disclosed. The process is generally applicable to the joining of two parts each formed from a metal, an alloy, or a combination thereof. The process finds special use in the formation of multi-celled batteries. The process involves placing two parts or electrical conductors in contact with each other and then bonding them to each other using a kinetic spray process and powder particles. In formation of a multi-celled battery the particles are preferably electrically conductive. The process enables for rapid and cost effective formation of a physical connection. In addition, the connection can have an electrical resistance of less than about 0.5 milli Ohms and strength equal or greater than ultrasonic welding. The process has the advantage of being a low temperature process thereby lowering the risk of thermal damage to the parts or cells of a multi-cell battery during formation of the connection.
申请公布号 US7900812(B2) 申请公布日期 2011.03.08
申请号 US20040999581 申请日期 2004.11.30
申请人 ENERDEL, INC. 发明人 TEETS RICHARD E.;VAN STEENKISTE THOMAS H.;KRUGER DUANE D.;BEER ROBERT C.
分类号 B23K31/02 主分类号 B23K31/02
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