PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PURPOSE: An improvement printed circuit board and a manufacturing method thereof are provided to implement the environment-friendly process by remarkably reducing the used amount of the organic and inorganic material which is used in the dry process. CONSTITUTION: A mold and a base substrate are arranged(S1). A groove of the second circuit pattern is formed on the insulation layer by inscribing the mold on the insulation layer(S2). A via hole passing through the insulating layer is formed(S3). The groove of the second circuit pattern and the inside of the via hole are filled with the conductive paste(S4).