POSITIVE TYPED PHOTOSENSITIVE COMPOSITION

摘要

PURPOSE: A positive typed photosensitive composition is provided to prevent the warpage of a semiconductor wafer, to facilitate the manipulation of a wafer in a semiconductor process, and to improve semiconductor process efficiency. CONSTITUTION: A positive typed photosensitive composition comprises a polyamide derivative represented by chemical formula (1). In chemical formula (1), R^1 and R^2 are independently divalent - hexavalent aryl groups of at least two carbon numbers; R^3 is hydrogen atom or alkyl group of carbon number 1-10; R^4 is alkyl group or aryl group with a linear structure; R^5 is divalent - hexavalent aryl groups with at least two carbon number or aryl group or aryl group with a linear structure; k and l are an integer of 10-1000; n and m are an integer of 0-2; and X is hydrogen atom or aryl group of carbon number 2 - 30.