发明名称 |
Methods for partially removing circuit patterns from a multi-project wafer |
摘要 |
Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without disclosing proprietary circuit information of other customers. At least one integrated circuit design of a user is identified from a plurality of integrated circuit designs of a plurality of users. Those unidentified circuits can be totally removed through circuit removing method. Then the modified multi-project wafer can be delivered to the user without concerns about disclosing information of unidentified circuits which belongs to other customers. In one embodiment, a laser system may be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits. In another embodiment, a diamond-blade saw may also be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits.
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申请公布号 |
US7904855(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20060536927 |
申请日期 |
2006.09.29 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSENG YI-HONG;WU KUAN-LIANG |
分类号 |
G06F17/50;H01L21/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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地址 |
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