发明名称 |
Dielectric layer for semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device comprises a silicate interface layer and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises metal alloy oxides.
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申请公布号 |
US7902019(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20080098373 |
申请日期 |
2008.04.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JONG-HO;LEE NAE-IN |
分类号 |
H01L21/8249;H01L21/28;H01L29/51;H01L29/788;H01L29/94 |
主分类号 |
H01L21/8249 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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