| 摘要 |
A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.
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