发明名称 Fixing structure of fixing a thermal module
摘要 A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.
申请公布号 US7903420(B2) 申请公布日期 2011.03.08
申请号 US20080056935 申请日期 2008.03.27
申请人 ASUSTEK COMPUTER INC. 发明人 CHUNG CHAO-TSAI;HSU KUO-JUNG
分类号 H05K7/20;F28F7/00;H01L23/26;H01L23/34 主分类号 H05K7/20
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