EVALUATION DEVICE OF SHEAR STRENGTH OF BUMP

摘要

PURPOSE: A device for evaluating the shear strength of a bump is provided to measure the coupling reliability of a bump constituting C4 of a semiconductor, a CPU, and a chip set. CONSTITUTION: A device for evaluating the shear strength of a bump comprises a plate(101), an elastic member(105), a transmission member(111), and a stopper(110). The plate fixes a substrate(106) and a test member(108) coupled with a bump(107). The plate comprises an insertion groove(109) opened to one side. The elastic member generates the movement of a hammer with external force. The transmission member is placed in the insertion groove to be movable. The transmission member transfers the elastic force to the test member.