| 摘要 |
Disclosed is a positive photosensitive resin composition having excellent electrical insulation properties, heat resistance, mechanical strength and electrical characteristics, which is capable of forming a high-resolution circuit pattern. The positive photosensitive resin is characterized by containing at least one kind of polyhydroxyamide resin (A) containing a repeating unit represented by formula (1) and having a weight average molecular weight of 3,000-20,000, and a compound (B) which generates an acid by the action of light. (In the formula, X represents a tetravalent aliphatic group or aromatic group; R1 and R2 independently represent a hydrogen atom or an alkyl group having 1-10 carbon atoms; Ar1 and Ar2 independently represent an aromatic group; Y represents an organic group containing at least one aromatic group substituted by a carboxyl group; n represents an integer of not less than 1; and l and m independently represent 0 or an integer of not less than 1 and satisfy l + m = 2.) |
