METHOD OF FABRICATING CAMERA MODULE

摘要

PURPOSE: A manufacturing method of a camera module is provided to prevent the failure of the pad and to improve the junction strength of a central part. CONSTITUTION: A semiconductor chip and a passive device are mounted for driving an image sensor. An electrode pad is formed in the upper part of a second substrate(12). The electrode pad is attached to a solder film(30). The lower part of a first substrate is attached to the upper part of the second substrate. The pad is formed in the lower part of the second substrate.