| 摘要 |
<p>Disclosed is a Cu-Ni-Si-Mg-based alloy comprising 1.0 to 4.5% by mass of Ni, 0.16 to 1.13% by mass of Si, and 0.05 to 0.30% by mass of Mg, with the remainder being Cu and unavoidable impurities. The Cu-Ni-Si-Mg-based alloy contains Ni-Si-Mg precipitates (X) and Ni-Si precipitates (Y), wherein the average particle diameter of the precipitates (X) is 0.05 to 3.0 µm, there is contained no precipitate (X) having a particle diameter of larger than 10 µm, and the average particle diameter of the precipitates (Y) is 0.01 to 0.10 µm. The copper alloy may contain Cr, P, Mn, Ag, Co, Mo, As, Sb, Al, Hf, Zr, Ti, C, Fe, In, Ta, Sn or Zn in the total amount of 0.01 to 2.0% by mass. Preferably, the precipitates (X) are contained at a density of 103 to 105 particles/mm2 and the precipitates (Y) are contained at a density of 1.0 × 108 to 1.0 × 1011 particles/mm2. The Cu-Ni-Si-Mg-based alloy has high strength, high electrical conductivity, and good bending workability, and also has excellent stress relaxation resistance under high temperatures.</p> |
