FUSE IN SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device fuse and manufacturing method thereof are provided to prevent a repair fuse defect due to migration by comprising a blowing part which has smaller diffusion coefficient than the pad of the fuse. CONSTITUTION: A wiring layer(102) is formed on a substrate(101). An insulating layer(103) is formed to cover the front of the structure including the wiring layer. A plug(104) connects the wiring layer and a conductive pattern(105) and passes through the insulation layer. The conductive pattern comprises a blowing part(105B) and a pad(105A).