| 摘要 |
PURPOSE: A semiconductor package is provided to prevent the total thickness of the package from being increase due to adhesives by attaching a semiconductor chip and a substrate without the adhesives. CONSTITUTION: Bond fingers(104) and a combining part(H) are arranged on a substrate(102). A semiconductor chip(108) is located on one side of the substrate. The semiconductor chip includes a plurality of bonding pads(110). The semiconductor chip is physically attached to the substrate through a protrusion. A connecting unit(112) electrically connects the bonding pads of the semiconductor chip and the bond fingers of the substrate. A sealing unit(114) seals one side of the substrate including the semiconductor chip and the connecting unit. |
