发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATION FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING SAME |
摘要 |
The object of the present invention is to provide a positive photosensitive resin composition which produces no scum and has high sensitivity and high resolution, a cured film, a protecting film, an insulating film, a semiconductor device using the same. The positive photosensitive resin composition of the present invention comprises a specific polyamide resin (A) and a photosensitive agent (B) comprising an ester of a specific phenolic compound with at least one of 1,2-naphthoquinonediazide-4-sulfonic acid and 1,2-naphthoquinonediazide-5-sulfonic acid. The cured film of the present invention comprises a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention comprise the cured film each. The semiconductor device and display device of the present invention have the cured film each. |
申请公布号 |
KR20110022661(A) |
申请公布日期 |
2011.03.07 |
申请号 |
KR20117000141 |
申请日期 |
2009.06.19 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
SUGIYAMA HIROMICHI;MAKABE HIROAKI |
分类号 |
G03F7/039;G03F7/022;G03F7/023 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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