METHOD OF FABRICATING LIGHT EMITTING DEVICE

摘要

PURPOSE: A light emitting device manufacturing method is provided to easily separate a growth substrate using an unfilled part by forming the unfilled part on the semiconductor layer formed on the growth substrate. CONSTITUTION: A substrate(101) equipped with a first semiconductor layer(102) and a metallic material layer(103) is loaded into a first chamber. A second semiconductor layer(104) is formed on the first semiconductor layer and the metallic material layer in the first chamber. An unfilled part(102a) is formed on a portion of the first semiconductor layer and is lower than the metallic material layer.