WAFER-LEVEL MOLDED STRUCTURE FOR PACKAGE ASSEMBLY

摘要

PURPOSE: A wafer level mold structure for package assembly is provided to improve the radiation capability of the package assembly by not forming a molding compound which covers the top die and/or the bottom die. CONSTITUTION: An upper die(10) is welded to a lower die(14). A molding compound(16) is located on the lower die and the upper die. The edge of the bottom die is aligned perpendicularly to the edge of the molding compound. An additional molding compound(24) touches the lower die. The molding compound and the additional molding compound have the visible interface(28) which is aligned with the edge of the lower die.