METHOD FOR CONSTRUCTION OF STAMP WITH SUBSTRATE TILTING

摘要

PURPOSE: A mold manufacturing method is provided to absorb the deposition material between minute patterns formed on the substrate by tilting the substrate when forming a metal thin film layer. CONSTITUTION: A pattern(37) is formed on a substrate(33). The pattern formed on the substrate has an interval of less than 50nm. A metal thin film layer(34) is deposited by tilting the substrate. The metal plating layer is plated on the substrate deposited with the metal thin film layer. The metal plating layer is separated from the substrate along with the metal thin film layer.