| 摘要 |
PURPOSE: A camera module is provided to prevent the overflow of an adhesive onto a circuit board. CONSTITUTION: A stepped coverage is formed on the both sides of a circuit board(101), and a passive device is formed on the upper plane of the circuit board. An image sensor(105) converts an external image into an electric signal, wherein the external image is transferred through a lens unit. The image sensor is formed on the circuit board, and a housing(102) encloses the external portion of the lens unit. The housing is coupled to an edge portion of the lowest layer of the circuit board through an adhesive.
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