A PRINTED CIRCUIT BOARD COMPRISING A DUMMY PATTERN AND A METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board is provided to improve the bending strength of the coreless printed circuit board without additional cost and minimize the scale variation in the panel with arrays. CONSTITUTION: A first circuit layer(110) is formed including a dummy area on one side. A build up insulating layer formed with the build up circuit layer which is connected to the first circuit layer is formed including the dummy area on the other side. A first open unit for exposing the first pad is formed among the first circuit layer. A second protective layer comprises a second open unit for exposing the second pad among the build up circuit layer. A circuit layer(103) formed on the dummy area improves the bending strength.