| 摘要 |
PURPOSE: A multilayer printed circuit board manufacturing method using a photosensitivity insulating film is provided to reduce the crack, the bunch burr, and the stress by implementing the trim off process with the areas of etched photosensitive insulation film. CONSTITUTION: An insulation film(100) is formed with a first conductive pattern(110) and a second conductive pattern(120). A first prepreg bonding layer(250) having a first opening is formed. A second prepreg bonding layer(260) having second opening is formed. The first opening and the second opening are formed on the locations which correspond to each other.
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