| 摘要 |
PURPOSE: A cheap bonding wire antenna communication module is provided to reduce manufacturing costs while being optimized for high efficiency. CONSTITUTION: A cheap bonding wire antenna communication module(100) comprises a semiconductor chip, including bonding pads arranged on a substrate, and a bonding wire antenna electrically connected to the bonding pads. The semiconductor chip of the communication module may comprise a cheap CMOS amplifier with the highest efficiency. |
