发明名称 |
CORE SOLDER BALLS, METHOD OF MANUFACTURING CORE SOLDER BALLS AND ELECTRONIC PARTS INCLUDING THE SAME |
摘要 |
PURPOSE: A core solder ball, a core solder ball manufacturing method, and an electronic component including the same are provided to restrain the generation of the metallic compound on the bonding boundary between a metal layer and a solder layer by forming the solder layer after forming dual metal layers. CONSTITUTION: A first metal layer(22) is formed on the surface of the metal or the plastic core(21). A second metal layer(23) including the metal of a kind different from the first metal layer is formed on the first metal layer. A first solder layer containing Sn-Cu or Sn-Ag is formed on the second metal layer. The second solder layer made of alloy different from the first solder layer is formed on the first solder layer.
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申请公布号 |
KR20110021618(A) |
申请公布日期 |
2011.03.04 |
申请号 |
KR20100001821 |
申请日期 |
2010.01.08 |
申请人 |
DUKSAN HIGH METAL CO., LTD. |
发明人 |
KIM, SUNG CHEOL;CHU, YONG CHEOL;CHUN, MYOUNG HO;LEE, HYUN KYU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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