发明名称 WORKPIECE DOUBLE-DISC GRINDING APPARATUS AND WORKPIECE DOUBLE-DISC GRINDING METHOD
摘要 A workpiece double-disc grinding apparatus including a holder that supports a thin-plate-like workpiece from an outer periphery along a radial direction and is rotatable; a pair of static pressure support members that support the holder from both sides along an axial direction of the rotation thereof in a contactless manner based on a static fluid pressure; and a pair of grinding stones that simultaneously grind both surfaces of a workpiece supported by the holder, in which an interval between the holder and the static pressure support member is not greater than 50 μm, and the static pressure of the fluid that is not lower than 0.3 MPa. As a result, the workpiece double-disc grinding apparatus and a workpiece double-disc grinding method can stabilize a position of the holder, which can be a cause that degrades a nanotopography of the workpiece in the double-disc grinding for the workpiece.
申请公布号 US2011053470(A1) 申请公布日期 2011.03.03
申请号 US20090812959 申请日期 2009.01.23
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 KATO TADAHIRO;KOBAYASHI KENJI
分类号 B24B1/00;B24B5/307;B24B7/17;B24B41/06;B24D3/00;B24D3/14;H01L21/304 主分类号 B24B1/00
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