| 摘要 |
The semiconductor device includes a substrate; a semiconductor chip mounted over the substrate; resin encapsulating the semiconductor chip; and a heat dissipation material that is arranged over the semiconductor chip and in contact with the resin, wherein the resin includes a first resin region made of a first resin composition, a second resin region made of a second resin composition, and a mixed layer that is formed between the first and second resin regions and obtained by mixing the first resin composition and the second resin composition. |
