发明名称 Light emitting diode package
摘要 <p>PURPOSE: A light emitting diode package is provided to improve the luminous efficiency of a light-emitting diode by reducing the amount of the light trapped in the side wall of the package body. CONSTITUTION: In a light emitting diode package, a pair of lead frames are provided. A package body(120) accepts one side of the lead frame. The package body includes a side wall of a ring shape forming a cavity(125) at the center. An LED chip(130) is mounted on the lead frame in the cavity.</p>
申请公布号 KR101018238(B1) 申请公布日期 2011.03.03
申请号 KR20080113398 申请日期 2008.11.14
申请人 发明人
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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