发明名称 LEAD-FREE SOLDER JOINING MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a versatile solder joining material which is usable for a power module with a high calorific value to be used for a power device or the like for driving and controlling an on-vehicle motor and the other electric motors, has excellent heat resistance properties or the like, and particularly, has excellent heat shock resistance, by a simple method. <P>SOLUTION: Cu and Ni having surplus concentrations are positively acted on an Sn matrix present in a lead-free solder alloy which becomes a master alloy 1 so as to form an intermetallic compound in the solder alloy, control is performed in such a manner that the intermetallic compound is made present in the solder alloy, an intermetallic compound is made present also in a solder joint, and melting at a temperature higher than the liquidus temperature of the lead-free solder alloy as the master alloy is achieved. Further, by adding Ga, the effect of improving the elongation properties in the solder joint is imparted together and thus, the material is made usable for the power module or the like to be used for the on-vehicle device in which durability of the soldered part is thought as important from a use environment accompanied with a severe temperature change. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011041970(A) 申请公布日期 2011.03.03
申请号 JP20090193081 申请日期 2009.08.24
申请人 NIHON SUPERIOR CO LTD 发明人 NISHIMURA TETSUO
分类号 B23K35/26;B23K1/00;B23K101/42;C22C13/00;C22F1/00;C22F1/16;H05K3/34 主分类号 B23K35/26
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