DISMANTLING ADHESIVE CONTAINING HALOGEN-BASED DISMANTLING COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a dismantling adhesive which enables to dismantle an adhered structure at a relatively low temperature by external stimulation in case of necessity after adhesion, and which avoids the restoration of its adhesive power after cooling.

SOLUTION: The dismantling adhesive contains an organic adhesive component and a compound comprising an organic cation and at least one anion selected from Cl-, F-, Br-and I-. which is represented by one of formulae (1) to (4) (wherein R+represents a compound prepared by protonating a≥1C organic compound).

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