| 发明名称 |
Front Side Copper Post Joint Structure for Temporary Bond in TSV Application |
| 摘要 |
An integrated circuit structure includes a semiconductor substrate; a conductive via (TSV) passing through the semiconductor substrate; and a copper-containing post overlying the semiconductor substrate and electrically connected to the conductive via.
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| 申请公布号 |
US2011049706(A1) |
申请公布日期 |
2011.03.03 |
| 申请号 |
US20100831819 |
申请日期 |
2010.07.07 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG HON-LIN;HSIAO CHING-WEN;HSU KUO-CHING;CHEN CHEN-SHIEN |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
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