发明名称 |
BEOL INTERCONNECT STRUCTURES AND RELATED FABRICATION METHODS |
摘要 |
Methods for forming voids in BEOL interconnect structures and BEOL interconnect structures. The methods include forming a temporary feature on a top surface of a first dielectric layer and depositing a second dielectric layer on the top surface of the first dielectric layer. The temporary feature is removed from the second dielectric layer to define a void in the second dielectric layer that is laterally adjacent to a conductive feature in the second dielectric layer. The void operates to reduce the effective dielectric constant of the second dielectric layer, which reduces parasitic capacitance between the conductive feature and other conductors in the BEOL interconnect structure.
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申请公布号 |
US2011049724(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
US20090547770 |
申请日期 |
2009.08.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDERSON BRENT A.;NOWAK EDWARD J.;RANKIN JED H. |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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