ELECTRONIC APPARATUS

摘要

Provided is an electronic apparatus having a structure wherein an electronic component arranged to overlap a substrate is effectively cooled.  A substrate extends by overlapping the electronic component, such as an HDD (26), which is arranged at a position adjacent to a suction port (23) formed on a case side surface with a space between the electronic component and the suction port (23), and by including the position adjacent to the suction port (23).  The substrate has a first vent, which is formed to extend from a position where the substrate overlaps the HDD (26) to a position deviated from the HDD (26) to the side of the suction port (23), and makes the air sucked from the suction port (23) flow in.