发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of following a change in the set temperature of a hot plate in a low-temperature region at a high speed while ensuring heat insulation of a cover (lid) of the hot plate. SOLUTION: The heat treatment apparatus has: a hot plate 50 for placing a substrate W and heating it; a lid 60 for covering the substrate W placed on the hot plate 50 and forming a processing chamber 41; and a temperature sensor 100 for measuring the temperature of the lid 60. The lid 60 has space layers 74, 75 formed between upper and lower surfaces, allows a cooling gas to circulate through the space layers 74, 75 in cooling the lid 60 and controls the flow rate of the cooling gas on the basis of an output signal of the temperature sensor 100. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011044663(A) 申请公布日期 2011.03.03
申请号 JP20090193386 申请日期 2009.08.24
申请人 TOKYO ELECTRON LTD 发明人 MATSUOKA NOBUAKI
分类号 H01L21/027;H05B3/00;H05B3/68 主分类号 H01L21/027
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