发明名称 |
Bauelement mit einer ringförmigen Metallstruktur und Verfahren |
摘要 |
<p>A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external contact pads attaches to the second main surface of the encapsulation body, and at least one external contact pad of the array of external contact pads electrically couples to the ring-shaped metal structure.</p> |
申请公布号 |
DE102010036978(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
DE20101036978 |
申请日期 |
2010.08.13 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
LACHNER, RUDOLF;BOECK, JOSEF;AUFINGER, KLAUS;KNAPP, HERBERT |
分类号 |
H01L23/36;H01L21/50;H01L21/60;H01L23/48;H01L23/50 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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