| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition which is excellent in finger-touch dryness of a dry coating, has high sensitivity, and allows a cured articlel to have high electroless gold plating resistance, soldering heat resistance, moisture resistance and electric insulation properties, and is advantageously applied for forming a cured film such as a solder resist for a printed wiring board and a flexible printed wiring board. <P>SOLUTION: The photocurable resin composition contains a photosensitive compound obtained by using, as a raw material, a compound having a structure represented by general formula (I) or its oligomer, a carboxyl group-containing resin and a photopolymerization initiator. In the general formula (I), R<SP>1</SP>represents (n+1)-valent polyhydric alcohol derivative, m and n are each expressed by an integer of ≥1, l is expressed by an integer of 0 or ≥1, R<SP>2</SP>represents CH<SB>2</SB>, C<SB>2</SB>H<SB>4</SB>, C<SB>3</SB>H<SB>6</SB>, C<SB>4</SB>H<SB>8</SB>, or a substituted aromatic ring or unsubstituted aromatic ring, and R<SP>3</SP>represents a substituted or unsubstituted aromatic ring. <P>COPYRIGHT: (C)2011,JPO&INPIT |
