| 摘要 |
PROBLEM TO BE SOLVED: To shorten a cycle time by mounting a component on a substrate in a suitable mounting mode in response to an operational state of an external device. SOLUTION: A serial mounting mode and a parallel mounting mode are selectively carried out, wherein (1) in the serial mounting mode, a series of operations for mounting a component by a first head unit 3 in a first mounting position P1, and then conveying it to a second mounting position P2 and mounting a component by a second head unit 4 in a second mounting position P2 are carried out on one substrate, and (2) in the parallel mounting mode, component mounting by the first head unit 3 and component mounting by the second head unit 4 are carried out on one substrate in parallel in either of the first mounting position P1 or second mounting position P2. By appropriately switching the mounding modes of the component between the serial mounting mode and parallel mounting mode, the component is mounted on the substrate in the suitable mounting mode in response to the operational state of the external device, and thus the cycle time can be shortened. COPYRIGHT: (C)2011,JPO&INPIT
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