| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card and a probe device, for sure connection of a probe pin to an electrode of a semiconductor element with less mismatching in impedance. SOLUTION: The probe card includes a ceramic wiring substrate 1 where a plurality of insulating resin layers 2 and a plurality of wiring layers 3 are alternately stacked on the upper surface of the substrate, with the wiring layers 3 positioned above and below the insulating layers 2 being connected together by a through conductor 4, and a probe pin 5 connected to the wiring layer 3 on the upper surface of the insulating resin layer 2 which is the top layer. A non formation region 6 of the insulating resin layer 2 which corresponds to a projected of a connection region to the wiring layer 3 of the probe pin 5, in top view, in at least one layer of the insulating resin layer 2, being the second or subsequent layers directly under the top layer. Thus, the electrode of the semiconductor element and the probe pin 5 are brought in sure contact with each other, being allowed to be matched with a requested impedance characteristic as much as possible, for better transmission of high frequency signals. COPYRIGHT: (C)2011,JPO&INPIT |
