发明名称 LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS
摘要 A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
申请公布号 US2011052444(A1) 申请公布日期 2011.03.03
申请号 US20090517652 申请日期 2009.06.04
申请人 HRAMETZ ANDY A;DUNCAN ALEX T 发明人 HRAMETZ ANDY A.;DUNCAN ALEX T.
分类号 C22C5/08 主分类号 C22C5/08
代理机构 代理人
主权项
地址