SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

Provided is a high-yield, highly reliable semiconductor device that is applicable to narrow-pitch semiconductor chips with large numbers of terminals. In the provided semiconductor device, in which a semiconductor chip having external terminals is embedded in an insulating layer on which a wiring conductor is formed, a hole is preformed in the insulating layer at a position corresponding to where the external terminal will be after the semiconductor chip is embedded and has contracted, and the wiring conductor is electrically connected to the external terminal via said preformed hole.