发明名称 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has high sensitivity and high resolution to g-line and i-line, can be developed with a general-purpose generator, and satisfies excellent strong alkali resistance. <P>SOLUTION: The positive photosensitive resin composition contains 100 pts.wt. of a resin (A) having a benzoxazole precursor structure, 0.1-100 pts.wt. of a polyamide resin constituted of a structure represented by general formula (1), and 1-50 pts.wt. of a photosensitizer (C), wherein X<SP>1</SP>and Y<SP>1</SP>are an organic group; R<SP>1</SP>and R<SP>2</SP>are independently H or a 1-15C organic group; and a denotes a polymerization degree and is 1-500. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011043573(A) 申请公布日期 2011.03.03
申请号 JP20090190319 申请日期 2009.08.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 IKEDA TAKUJI
分类号 G03F7/023;C08G73/22;G03F7/004;G03F7/038;H01L21/027 主分类号 G03F7/023
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