发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has excellent Schottky characteristics by preventing surface deterioration of a surface of a nitride semiconductor due to natural oxidation and a heat treatment. SOLUTION: The semiconductor device is manufactured by forming: a GaN buffer layer 102 formed on a substrate 101 without positively implanting an impurity; an Al<SB>x</SB>Ga<SB>y</SB>In<SB>1-x-y</SB>N barrier layer 103 having a larger band gap than the GaN buffer layer 102 has and made of a second nitride semiconductor; a source electrode 105 and a drain electrode 107 formed on and in ohmic contact with an upper surface of the Al<SB>x</SB>Ga<SB>y</SB>In<SB>1-x-y</SB>N barrier layer 103; and a gate electrode 106 provided between the source electrode 105 and drain electrode 107. Then, the gate electrode 106 composed of a high-concentration n-type Ga<SB>a</SB>In<SB>1-a</SB>N gate electrode 106a which has a smaller band gap than the second nitride semiconductor has and in which an n-type impurity is positively implanted, and an electrode 106b for gate voltage transmission. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011044457(A) |
申请公布日期 |
2011.03.03 |
申请号 |
JP20090189850 |
申请日期 |
2009.08.19 |
申请人 |
NIPPON TELEGR & TELEPH CORP |
发明人 |
HIROKI MASANOBU;SHIGEKAWA NAOTERU |
分类号 |
H01L21/338;H01L21/28;H01L29/417;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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