| 摘要 |
A first insulating film, a second insulating film, a first resist pattern is formed on a semiconductor substrate, the second insulating film is etched to form a second-insulating-film pattern, a third insulating film is deposited over the second-insulating-film pattern to form a third-insulating-film pattern, the first insulating film is etched to form a first-insulating-film pattern, a fourth insulating film and a second resist pattern is formed over the first-insulating-film pattern, fourth insulating film is etched to form a fourth-insulating-film pattern, a fifth insulating film is deposited over the fourth-insulating-film pattern to form a fifth-insulating-film pattern, line parts of first-insulating-film pattern is etched to form a first-insulating-film pattern for wiring, a wiring film is formed over the first-insulating-film pattern for wiring, the wiring film is removed until the first-insulating-film pattern for wiring is exposed to form a wiring pattern.
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