| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high productivity and reliability and mounted with a semiconductor chip on a solid electrolytic capacitor. <P>SOLUTION: The semiconductor device includes a lead frame having an island 13, a motor-driven lead 24 and a GND lead 25; the sheet-like solid electrolytic capacitor 26 mounted on the island 13; the semiconductor chip 12, mounted on the solid electrolytic capacitor 26 and having a plane area larger than that of the solid electrolytic capacitor 26; and a bonding wire 15 for connecting the semiconductor chip 12 to the solid electrolytic capacitor 26, and for connecting the solid electrolytic capacitor 26 to the motor-driven lead 24 or the GND lead 25, and a metal foil 10 is provided, at least in a vertical-directional projection portion of a bonding wire connection part of the semiconductor chip 12, on the semiconductor electrolytic capacitor 26. <P>COPYRIGHT: (C)2011,JPO&INPIT |
